Scanning Heads in Laser perforation
Laser perforation technology, also referred to as MAP perforation , is distinguished by its precision and ability to create complex configurations with improved aesthetic and functional characteristics.
Technological advantages of laser perforation
Unlike standard mechanical perforation practices, laser drilling for packaging presents considerable advancements in:
Advanced Precision: Laser perforation is software-controlled, allowing continuous modulation of hole size according to process parameters, without interruptions or tool changes. This allows waste and defects to be minimized during production.
Material integrity: The laser's controlled thermal energy reduces mechanical stresses on the substrate, maintaining the film's structural properties.
Precise control of gas and moisture flow:
Laser-created microholes (as low as 40µm) make it possible to adjust the permeability of the packaging and protect the finished product from contaminants, even in the case of small (single-dose) packages.
Galvanometric scanners for laser positioning
Galvanometer technology is crucial for the dynamic control of the laser beam. In a galvanometer system, mirrors are mounted on rotating shafts and driven electromagnetically through coils, allowing precise modulation of their angular position. This enables rapid and accurate steering of the laser beam across a defined area, forming the foundation of modern scanning laser systems.
Dual-axis configurations, where two galvanometer mirrors are oriented perpendicularly, allow the beam to be directed anywhere within a two-dimensional plane. This setup provides exceptional flexibility, making it possible to produce intricate patterns, high-density perforations, and complex geometries that are difficult or impossible with traditional mechanical methods.
To ensure consistent performance across the entire processing area, specialized optics such as F-theta lenses are used. These lenses maintain uniform focus regardless of beam position, delivering precise, repeatable feature sizes and uniform energy distribution throughout the working field.
Compared to conventional mechanical techniques, scanning laser systems significantly increase processing speed. The non-contact operation eliminates tool wear and reduces mechanical stress on materials, resulting in higher productivity and less material waste. These advantages make scanning laser technology an ideal solution for industries demanding high-speed, precise, and efficient material processing, from packaging films to advanced composites.
Conclusions
Laser scanning systems optimize beam positioning with high speed, thus ensuring faster work and better competitiveness.
Spark Machinery Solution
Spark Machinery's LO-S 40 is designed for microperforation on single and bi-oriented multilayer films. Ideal for microperforating and scoring applications on IV and V range, MAP and EMAP packages, this system ensures superior quality as well as faster processing in the most demanding processes.
OPERATION and ADJUSTMENT of the LO-S 40 is entrusted to our software with 4.0 readiness. From the control touch screen, the operator manages all operations inherent to the device such as adjusting laser pulses, diameter and hole position. The electronics are set up with a PC through which the operator can control each scanning head and decide the working pattern.
With Spark Machinery, technological innovation results in industrial solutions of high precision and maximum efficiency.
Contact our Sales Office at info@sparkmachinery.com for consultation, carry out tests, feasibility studies, and for any information!