High-Precision Laser Perforators
Maximize efficiency, precision, and durability in your production process
Our Laser Micro Perforators
Series:LO Series
Function: High-precision laser micro-perforation, scoring, pre-cutting, and engraving of moving film webs, enabling controlled and repeatable material processing without mechanical contact.
Applications: Designed for advanced packaging needs including MAP/EMAP packaging, easy-open features, and breathable films used across food, pharmaceutical, and automotive sectors. Ensures extended shelf life, user convenience, and optimal material performance.
Technology: CO₂ laser-based systems equipped with galvanometric scanning heads (Model LO-S40) and adjustable parameters including pulse frequency, laser energy, and processing speed. Supports full integration with vision inspection and control systems for real-time monitoring and alignment. Industry 4.0-ready architecture with touchscreen control, recipe management, and remote diagnostics capability.
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LASER ONE - MICRO perforation LASER system for 40µm to 200µm holes and pre-cuts
Operation
The film, kept under constant tension by idler rollers, passes through the system where a CO₂ laser emits infrared beams. These are expanded via a beam expander and focused by a lens onto the film surface. Micro-perforation is performed through thermal sublimation of the material.
Control & Adjustment
The LASER‑ONE system is managed via Industry 4.0-ready software on a touchscreen panel. Operators can adjust pulse frequency, hole diameter, and position. The laser can perform both full perforation and scoring (partial depth weakening) for features like easy-open lines.
| TECHNICAL DATA SHEET | |
|---|---|
| Product | Laser perforation system |
| Laser Source Type | CO2 laser source |
| Hole Ø | Min. Ø40µm |
| Maximum Speed | 250* meters/minute |
| Maximum power of the laser source | 1500W* |
| Control system | Control panel with custom PLC and PC with remote assistance |
| Software | 4.0 integration and recipe management (insertion, storage, recall) |
| Cooling system | Liquid |
| Accessories | Encoder and Photocell |
| * | Value influenced by the type of processed material and machine configuration |
LO-S40 - Scanning LASER MICRO perforation system, for 70µm to 200µm holes, pre-cuts and engraving
Operation
The film, tensioned by idler rollers, is processed by a CO₂ laser emitting infrared beams. These are expanded, then steered by high-speed motorized scanning mirrors, enabling precise, dynamic positioning of each perforation. A focusing lens concentrates the beam onto the film, achieving micro-perforation via thermal sublimation.
Control & Adjustment
The LO-S40 is equipped with Industry 4.0-ready software and a touchscreen interface. Operators can control laser pulse, hole size, position, and manage each scanning head independently to define complex patterns. An integrated camera system (optional) provides real-time visual feedback for alignment, quality control, and process validation.
The system supports both micro-perforation and scoring (partial material weakening) for applications like easy-open features.
| TECHNICAL DATA SHEET | |
|---|---|
| Product | Scanning Laser perforation system |
| Number of laser sources installed | Minimum 1 laser source -> Maximum 6 laser sources |
| Hole Ø | Ø Min. 70µm |
| Max Speed | 380* meters/minute |
| Software | 4.0 integration and recipe management (insertion, storage, recall) |
| Control system | Control panel with custom PLC and PC with remote assistance |
| Maximum power of the laser source | 1500W* |
| Signal Resolution | 10 micro seconds |
| Pulse frequency | maximum frequency 50 kHz |
| Cooling System | Liquid |
| * | Value influenced by the type of processed material and machine configuration |
